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HiPerFASTTM IGBT with Diode Lightspeed Series Preliminary data IXGH 24N60CD1 VCES = 600 V = 48 A IXGT 24N60CD1 IC25 VCE(sat) = 2.5 V Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGE = 1 MW Continuous Transient TC = 25C TC = 110C TC = 25C, 1 ms VGE = 15 V, TVJ = 125C, RG = 22 W Clamped inductive load, L = 100 mH TC = 25C Maximum Ratings 600 600 20 30 48 24 80 ICM = 48 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 V V V V A A A A TO-268 (IXGT) G E C (TAB) TO-247 AD (IXGH) C (TAB) G C E C = Collector, TAB = Collector W C C C C G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md Weight Mounting torque (M3) TO-247 TO-268 1.13/10 Nm/lb.in. 6 4 g g Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 600 2.5 TJ = 25C TJ = 150C 5.5 200 3 100 2.1 2.5 V V mA mA nA V Features * International standard packages JEDEC TO-247 and surface mountable TO-268 * High frequency IGBT * High current handling capability * Latest generation HDMOSTM process * MOS Gate turn-on - drive simplicity * Fast recovery expitaxial Diode (FRED) - soft recovery with low IRM Applications * PFC circuits * Uninterruptible power supplies (UPS) * Switched-mode and resonant-mode power supplies * AC motor speed control * DC servo and robot drives * DC choppers Advantages * High power density * Very fast switching speeds for high frequency applications BVCES VGE(th) ICES IGES VCE(sat) IC IC = 750 mA, VGE = 0 V = 250 mA, VCE = VGE VCE = 0.8 * VCES VGE = 0 V VCE = 0 V, VGE = 20 V IC = IC110, VGE = 15 V IXYS reserves the right to change limits, test conditions, and dimensions. 98603A (4/99) (c) 2000 IXYS All rights reserved 1-5 IXGH 24N60CD1 IXGT 24N60CD1 Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 9 17 1500 VCE = 25 V, VGE = 0 V, f = 1 MHz 170 40 55 IC = IC110, VGE = 15 V, VCE = 0.5 VCES 13 17 Inductive load, TJ = 25C IC = IC110, VGE = 15 V, L = 100 mH, VCE = 0.8 VCES, RG = Roff = 10 W Remarks: Switching times may increase for VCE (Clamp) > 0.8 * VCES, higher TJ or increased RG Inductive load, TJ = 125C IC = IC110, VGE = 15 V, L = 100 mH VCE = 0.8 VCES, RG = Roff = 10 W Remarks: Switching times may increase for VCE (Clamp) > 0.8 * VCES, higher TJ or increased RG 15 25 75 60 0.24 15 25 1 130 110 0.6 140 110 0.36 S pF pF pF nC nC nC ns ns ns ns mJ ns ns mJ ns ns mJ 0.83 K/W (TO-247) 0.25 K/W TO-268AA (D3 PAK) Dim. Millimeter Min. Max. A B C D E F G H J K L M N 19.81 20.32 20.80 21.46 15.75 16.26 3.55 3.65 4.32 5.49 5.4 6.2 1.65 2.13 4.5 1.0 1.4 10.8 11.0 4.7 0.4 5.3 0.8 Inches Min. Max. 0.780 0.800 0.819 0.845 0.610 0.640 0.140 0.144 0.170 0.216 0.212 0.244 0.065 0.084 0.177 0.040 0.055 0.426 0.433 0.185 0.209 0.016 0.031 0.087 0.102 TO-247 AD (IXGH) Outline gfs C ies Coes C res Qg Qge Qgc td(on) t ri td(off) tfi Eoff td(on) t ri Eon td(off) tfi Eoff RthJC RthCK IC = IC110; VCE = 10 V, Pulse test, t 300 ms, duty cycle 2 % 1.5 2.49 Reverse Diode (FRED) Symbol VF IRM t rr RthJC Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1.6 2.5 6 100 25 V V A ns ns 0.9 K/W Min. Recommended Footprint IF = IC110, VGE = 0 V, TJ = 150C Pulse test, t 300 ms, duty cycle d 2 % TJ = 25C IF = IC110, VGE = 0 V, -diF/dt = 100 A/ms VR = 100 V IF = 1 A; -di/dt = 100 A/ms; VR = 30 V TJ = 100C TJ = 25C Dim. A A1 A2 b b2 C D E E1 e H L L1 L2 L3 L4 Millimeter Min. Max. 4.9 5.1 2.7 2.9 .02 .25 1.15 1.45 1.9 2.1 .4 .65 13.80 14.00 15.85 16.05 13.3 13.6 5.45 BSC 18.70 19.10 2.40 2.70 1.20 1.40 1.00 1.15 0.25 BSC 3.80 4.10 Inches Min. Max. .193 .201 .106 .114 .001 .010 .045 .057 .75 .83 .016 .026 .543 .551 .624 .632 .524 .535 .215 BSC .736 .752 .094 .106 .047 .055 .039 .045 .010 BSC .150 .161 (c) 2000 IXYS All rights reserved IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 2-5 IXGH 24N60CD1 IXGT 24N60CD1 50 TJ = 25C 200 VGE = 15V 13V 11V 9V TJ = 25C VGE = 15V 40 160 13V IC - Amperes IC - Amperes 30 20 7V 120 11V 80 9V 10 0 0 1 2 3 4 5 40 7V 0 0 4 8 12 16 20 VCE - Volts Fig. 1 Saturation Voltage Characteristics VCE - Volts Fig. 2 Extended Output Characteristics 50 TJ = 125C 1.4 VGE = 15V 13V 11V 9V 40 VCE (sat) - Normalized VGE = 15V IC = 48A 1.2 IC = 24A IC - Amperes 30 7V 1.0 IC = 12A 20 10 5V 0.8 0 0 1 2 3 4 5 0.6 25 50 75 100 125 150 VCE - Volts Fig. 3 Saturation Voltage Characteristics Fig.4 TJ - Degrees C Temperature Dependence of VCE(sat) 50 VCE = 10V f = 1Mhz 30 TJ = 125C Capacitance - pF 40 1000 Ciss IC - Amperes 20 TJ = 25C 100 Coss 10 0 2 3 4 5 6 7 8 9 10 10 0 5 10 15 20 Crss 25 30 35 40 VGE - Volts Fig. 5 Admittance Curves (c) 2000 IXYS All rights reserved VCE-Volts Fig. 6 Temperature Dependence of VF & VF 3-5 IXGH 24N60CD1 IXGT 24N60CD1 1.00 TJ = 125C 2.0 RG = 10W 2.0 TJ = 125C E(OFF) IC =48A E(ON) 2.0 E(OFF) - milliJoules E(ON) - millijoules E(ON) 0.50 E(OFF) E(ON) - millijoules 0.75 1.5 1.5 1.5 E(OFF) - millijoules 1.0 1.0 E(ON) IC = 24A E(OFF) IC = 12A E(OFF) 1.0 0.25 0.5 0.5 E(ON) 0.5 0.00 0 10 20 30 40 0.0 50 0.0 0.0 0 10 20 30 40 50 60 IC - Amperes Fig.7. Dependence of EOFF and EOFF on IC RG - Ohms Fig.8. Dependence of EOFF on RG 16 VCE = 300V IC = 24A 100 40 12 IC - Amperes VGE - Volts 10 TJ = -55 to +125C 8 RG = 4.7W dV/dt < 5V/ns 1 4 0 0 20 40 60 80 0.1 0 100 200 300 400 500 600 Qg - nanocoulombs VCE - Volts Fig.9. Gate Charge Fig.10. Turn-off Safe Operating Area 1 D=0.5 D=0.2 ZthJC (K/W) 0.1 D=0.1 D=0.05 D=0.02 0.01 D=0.01 Single pulse D = Duty Cycle 0.001 0.00001 0.0001 0.001 0.01 0.1 1 Pulse Width - Seconds Fig. 11 IGBT Transient Thermal Resistance (c) 2000 IXYS All rights reserved 4-5 IXGH 24N60CD1 IXGT 24N60CD1 60 A 50 IF 40 1000 nC 800 Qr TVJ= 100C VR = 300V IF= 60A IF= 30A IF= 15A IRM 30 A 25 20 15 TVJ= 100C VR = 300V IF= 60A IF= 30A IF= 15A TVJ=150C 30 600 TVJ=100C 20 400 10 TVJ=25C 10 0 0 1 2 VF 3V 200 5 0 A/ms 1000 -diF/dt 0 200 400 600 A/ms 1000 800 -diF/dt 0 100 Fig. 12 Forward current IF versus VF Fig. 13 Reverse recovery charge Qr versus -diF/dt 90 ns Fig. 14 Peak reverse current IRM versus -diF/dt 20 2.0 TVJ= 100C VR = 300V 1.5 Kf 1.0 trr 80 V VFR 15 TVJ= 100C IF = 30A V FR tfr 1.00 s tfr 0.75 I RM 70 0.5 IF= 60A IF= 30A IF= 15A 10 0.50 5 0.25 Qr 0.0 0 40 80 120 C 160 TVJ 60 0 200 400 600 -diF/dt 800 A/ms 1000 0 0 200 400 0.00 600 A/ms 1000 800 diF/dt Fig. 15 Dynamic parameters Qr, and IRM versus TVJ temperature 1 K/W Fig. 16 Recovery time trr versus -diF/dt Fig. 17 Peak forward voltage VFR and tfr versus diF/dt Constants for ZthJC calculation: i Rthi (K/W) 0.502 0.193 0.205 ti (s) 0.0052 0.0003 0.0162 0.1 ZthJC 1 2 3 0.01 0.001 0.00001 DSEP 29-06 0.0001 0.001 0.01 0.1 t s 1 Fig. 18 Transient thermal resistance junction to case (c) 2000 IXYS All rights reserved 5-5 |
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